EP20K100QC208-2 vs EP20K100BC356-3 feature comparison

EP20K100QC208-2 Altera Corporation

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EP20K100BC356-3 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code QFP
Package Description PLASTIC, QFP-208 LBGA, BGA356,26X26,50
Pin Count 208
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBGA-B356
JESD-609 Code e0 e0
Length 28 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 159 252
Number of Inputs 153 246
Number of Logic Cells 4160 4160
Number of Outputs 153 246
Number of Terminals 208 356
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 159 I/O 4 DEDICATED INPUTS, 252 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Equivalence Code QFP208,1.2SQ,20 BGA356,26X26,50
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 3 ns 3.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.63 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 28 mm 35 mm
Base Number Matches 4 3
ECCN Code 3A991.D

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