EP2A25B724C8
vs
EP2A25B724C9
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
35 X 35 MM, 1.27 MM PITCH, BGA-724
|
35 X 35 MM, 1.27 MM PITCH, BGA-724
|
| Pin Count |
724
|
724
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B724
|
S-PBGA-B724
|
| JESD-609 Code |
e0
|
e0
|
| Length |
35 mm
|
35 mm
|
| Number of I/O Lines |
536
|
536
|
| Number of Inputs |
524
|
524
|
| Number of Logic Cells |
24320
|
24320
|
| Number of Outputs |
524
|
524
|
| Number of Terminals |
724
|
724
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
536 I/O
|
536 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA724,27X27,50
|
BGA724,27X27,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
220
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Propagation Delay |
1.94 ns
|
2.23 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.5 mm
|
3.5 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EP2A25B724C8 with alternatives
Compare EP2A25B724C9 with alternatives