EP2AGX190EF29C6N
vs
EP2AGX190EF29I5N
feature comparison
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Life Cycle Code |
|
Transferred
|
Ihs Manufacturer |
|
ALTERA CORP
|
Part Package Code |
|
BGA
|
Package Description |
|
29 X 29 MM, LEAD FREE, MS-034, FBGA-780
|
Pin Count |
|
780
|
Reach Compliance Code |
|
not_compliant
|
HTS Code |
|
8542.39.00.01
|
Clock Frequency-Max |
|
500 MHz
|
JESD-30 Code |
|
S-PBGA-B780
|
JESD-609 Code |
|
e1
|
Length |
|
29 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
372
|
Number of Logic Cells |
|
181165
|
Number of Outputs |
|
372
|
Number of Terminals |
|
780
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HBGA
|
Package Equivalence Code |
|
BGA780,28X28,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
|
250
|
Programmable Logic Type |
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.7 mm
|
Supply Voltage-Max |
|
0.93 V
|
Supply Voltage-Min |
|
0.87 V
|
Supply Voltage-Nom |
|
0.9 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
29 mm
|
Base Number Matches |
|
1
|
|
|
|
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