EP2AGX45DF25C5N
vs
EP2AGX45DF25C4N
feature comparison
Rohs Code |
|
No
|
Part Life Cycle Code |
|
Obsolete
|
Ihs Manufacturer |
|
INTEL CORP
|
Package Description |
|
25 X 25 MM, LEAD FREE, MS-034, FBGA-572
|
Reach Compliance Code |
|
compliant
|
HTS Code |
|
8542.39.00.01
|
Samacsys Manufacturer |
|
Intel
|
Clock Frequency-Max |
|
500 MHz
|
JESD-30 Code |
|
S-PBGA-B572
|
JESD-609 Code |
|
e1
|
Length |
|
25 mm
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
1805
|
Number of Inputs |
|
260
|
Number of Logic Cells |
|
42959
|
Number of Outputs |
|
260
|
Number of Terminals |
|
572
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
1805 CLBS
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HBGA
|
Package Equivalence Code |
|
BGA572,24X24,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
Programmable Logic Type |
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.2 mm
|
Supply Voltage-Max |
|
0.93 V
|
Supply Voltage-Min |
|
0.87 V
|
Supply Voltage-Nom |
|
0.9 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
25 mm
|
Base Number Matches |
|
1
|
|
|
|
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