EP2AGX45DF25C6N vs EP2AGX45DF25C5 feature comparison

EP2AGX45DF25C6N Altera Corporation

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EP2AGX45DF25C5 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Pin Count 572
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Clock Frequency-Max 500 MHz
JESD-30 Code S-PBGA-B572 S-PBGA-B572
JESD-609 Code e1
Length 25 mm
Moisture Sensitivity Level 3
Number of Inputs 252 252
Number of Logic Cells 42959 42959
Number of Outputs 252 252
Number of Terminals 572 572
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC
Package Code HBGA BGA
Package Equivalence Code BGA572,24X24,40 BGA572,24X24,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max 0.93 V
Supply Voltage-Min 0.87 V
Supply Voltage-Nom 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 25 mm
Base Number Matches 1 3

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