EP2AGX45DF25C6N vs EP2AGX45DF25C6N feature comparison

EP2AGX45DF25C6N Altera Corporation

Buy Now Datasheet

EP2AGX45DF25C6N Altera Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Pin Count 572 572
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 500 MHz 500 MHz
JESD-30 Code S-PBGA-B572 S-PBGA-B572
JESD-609 Code e1 e1
Length 25 mm 25 mm
Moisture Sensitivity Level 3 3
Number of Inputs 252 252
Number of Logic Cells 42959 42959
Number of Outputs 252 252
Number of Terminals 572 572
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA572,24X24,40 BGA572,24X24,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 25 mm 25 mm
Base Number Matches 1 1

Compare EP2AGX45DF25C6N with alternatives

Compare EP2AGX45DF25C6N with alternatives