EP2AGX45DF25C6N
vs
EP2AGX45DF25I5N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
|
Ihs Manufacturer |
ALTERA CORP
|
|
Part Package Code |
BGA
|
|
Package Description |
25 X 25 MM, LEAD FREE, MS-034, FBGA-572
|
|
Pin Count |
572
|
|
Reach Compliance Code |
not_compliant
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
Intel
|
|
Clock Frequency-Max |
500 MHz
|
|
JESD-30 Code |
S-PBGA-B572
|
|
JESD-609 Code |
e1
|
|
Length |
25 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Inputs |
252
|
|
Number of Logic Cells |
42959
|
|
Number of Outputs |
252
|
|
Number of Terminals |
572
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HBGA
|
|
Package Equivalence Code |
BGA572,24X24,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.2 mm
|
|
Supply Voltage-Max |
0.93 V
|
|
Supply Voltage-Min |
0.87 V
|
|
Supply Voltage-Nom |
0.9 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
25 mm
|
|
Base Number Matches |
1
|
|
|
|
|
Compare EP2AGX45DF25C6N with alternatives