EP2C15AF256I7
vs
EP2C15AF256A7N
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
FBGA-256
|
LBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO REQUIRES 3.3 SUPPLY
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e1
|
Length |
17 mm
|
17 mm
|
Number of Inputs |
152
|
|
Number of Logic Cells |
14448
|
|
Number of Outputs |
144
|
|
Number of Terminals |
256
|
256
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Samacsys Manufacturer |
|
Intel
|
Clock Frequency-Max |
|
450 MHz
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
903
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
903 CLBS
|
Peak Reflow Temperature (Cel) |
|
260
|
Temperature Grade |
|
AUTOMOTIVE
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EP2C15AF256I7 with alternatives
Compare EP2C15AF256A7N with alternatives