EP2C35F484C6N
vs
EP2C35U484C8
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
LEAD FREE, FBGA-484
|
UBGA-484
|
Pin Count |
484
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
ALSO REQUIRES 3.3 SUPPLY
|
ALSO REQUIRES 3.3 SUPPLY
|
Clock Frequency-Max |
500 MHz
|
402.5 MHz
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e0
|
Length |
23 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2076
|
2076
|
Number of Inputs |
322
|
322
|
Number of Logic Cells |
33216
|
33216
|
Number of Outputs |
306
|
306
|
Number of Terminals |
484
|
484
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
2076 CLBS
|
2076 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FBGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.2 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
23 mm
|
19 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EP2C35F484C6N with alternatives
Compare EP2C35U484C8 with alternatives