EP2C35F484C8N vs EP2C35U484C8 feature comparison

EP2C35F484C8N Intel Corporation

Buy Now Datasheet

EP2C35U484C8 Intel Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description LEAD FREE, FBGA-484 UBGA-484
Reach Compliance Code compliant compliant
ECCN Code 3A991
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 402.5 MHz 402.5 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2076 2076
Number of Inputs 322 322
Number of Logic Cells 33216 33216
Number of Outputs 306 306
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2076 CLBS 2076 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.2 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 19 mm
Base Number Matches 1 2

Compare EP2C35F484C8N with alternatives

Compare EP2C35U484C8 with alternatives