EP2C35U484C8 vs EP2C35F484C8N feature comparison

EP2C35U484C8 Intel Corporation

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EP2C35F484C8N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description UBGA-484 LEAD FREE, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 402.5 MHz 402.5 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2076 2076
Number of Inputs 322 322
Number of Logic Cells 33216 33216
Number of Outputs 306 306
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2076 CLBS 2076 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 23 mm
Base Number Matches 2 2
ECCN Code 3A991
Samacsys Manufacturer Intel
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare EP2C35F484C8N with alternatives