EP2C35U484I8N
vs
EP2C35U484I7
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LEAD FREE, UBGA-484
|
FBGA-484
|
| Pin Count |
484
|
484
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
ALSO REQUIRES 3.3 SUPPLY
|
ALSO REQUIRES 3.3 SUPPLY
|
| Clock Frequency-Max |
402.5 MHz
|
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
| JESD-609 Code |
e1
|
e0
|
| Length |
19 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
2076
|
2100
|
| Number of Inputs |
322
|
322
|
| Number of Logic Cells |
33216
|
33216
|
| Number of Outputs |
306
|
306
|
| Number of Terminals |
484
|
484
|
| Organization |
2076 CLBS
|
2100 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
BGA
|
| Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
19 mm
|
23 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare EP2C35U484I8N with alternatives
Compare EP2C35U484I7 with alternatives