EP2C50F484C8 vs EP2C50F484I6N feature comparison

EP2C50F484C8 Intel Corporation

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EP2C50F484I6N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-484 LEAD FREE, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 402.5 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of CLBs 3158 3182
Number of Inputs 294 294
Number of Logic Cells 50528 50528
Number of Outputs 278 278
Number of Terminals 484 484
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 3158 CLBS 3182 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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