EP2C70F896C7 vs EP2C70F896C8 feature comparison

EP2C70F896C7 Intel Corporation

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EP2C70F896C8 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-896 FBGA-896
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 450 MHz 402.5 MHz
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4276 4276
Number of Inputs 622 622
Number of Logic Cells 68416 68416
Number of Outputs 606 606
Number of Terminals 896 896
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4276 CLBS 4276 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 2 2

Compare EP2C70F896C7 with alternatives

Compare EP2C70F896C8 with alternatives