EP2C8F256C8N vs EP2C8F256C8 feature comparison

EP2C8F256C8N Altera Corporation

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EP2C8F256C8 Altera Corporation

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description LEAD FREE, FBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Additional Feature ALSO REQUIRES 3.3 SUPPLY ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max 402.5 MHz 402.5 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 516 516
Number of Inputs 182 182
Number of Logic Cells 8256 8256
Number of Outputs 174 174
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 516 CLBS 516 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 235
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 17 mm 17 mm
Base Number Matches 1 2

Compare EP2C8F256C8N with alternatives

Compare EP2C8F256C8 with alternatives