EP2S15F672C5 vs EP2S15F672C3N feature comparison

EP2S15F672C5 Altera Corporation

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EP2S15F672C3N Intel Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 35 X 35 MM, 1 MM PITCH, FBGA-672 35 X 35 MM, 1 MM PITCH, FBGA-672
Pin Count 672
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 640 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.962 ns 4.45 ns
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6240 6240
Number of Inputs 366 366
Number of Logic Cells 15600 15600
Number of Outputs 358 358
Number of Terminals 672 672
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 6240 CLBS 6240 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 35 mm 35 mm
Base Number Matches 2 1

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