EP330LC-12
vs
PAL16L8A-2DMB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DIP, DIP20,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
100 MHz
|
|
| JESD-30 Code |
S-PQCC-J20
|
R-XDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.017 mm
|
|
| Number of Dedicated Inputs |
9
|
|
| Number of I/O Lines |
8
|
|
| Number of Inputs |
18
|
16
|
| Number of Outputs |
8
|
8
|
| Number of Product Terms |
72
|
64
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
9 DEDICATED INPUTS, 8 I/O
|
|
| Output Function |
MACROCELL
|
COMBINATORIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP20,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Programmable Logic Type |
OT PLD
|
EE PLD
|
| Propagation Delay |
13 ns
|
40 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
9.017 mm
|
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare EP330LC-12 with alternatives
Compare PAL16L8A-2DMB with alternatives