EP3C25E144I7N
vs
EP3C25E144I7
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
22 X 22 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LEAD FREE, EQFP-144
|
22 X 22 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, EQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
R-PQFP-G144
|
R-PQFP-G144
|
| JESD-609 Code |
e3
|
e0
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
24624
|
24624
|
| Number of Inputs |
82
|
82
|
| Number of Logic Cells |
24624
|
24624
|
| Number of Outputs |
82
|
82
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
24624 CLBS
|
24624 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EP3C25E144I7N with alternatives
Compare EP3C25E144I7 with alternatives