EP3C25F256C8NES
vs
EP3C25F256I7
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
|
17 X 17 MM, 1 MM PITCH, FBGA-256
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e0
|
| Length |
17 mm
|
17 mm
|
| Number of CLBs |
24624
|
24624
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
24624 CLBS
|
24624 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
256
|
| Samacsys Manufacturer |
|
Intel
|
| Moisture Sensitivity Level |
|
3
|
| Number of Inputs |
|
156
|
| Number of Logic Cells |
|
24624
|
| Number of Outputs |
|
156
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare EP3C25F256C8NES with alternatives
Compare EP3C25F256I7 with alternatives