EP3SL70F780I3N vs EP3SL70F780C2 feature comparison

EP3SL70F780I3N Intel Corporation

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EP3SL70F780C2 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description LEAD FREE, FBGA-780 BGA, BGA780,28X28,40
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Number of CLBs 2700
Number of Inputs 488 488
Number of Logic Cells 67500 67500
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2700 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.5 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 780
Clock Frequency-Max 800 MHz
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Technology CMOS
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 20

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