EP4CE6E22C7
vs
EP4CE6E22C6
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
QFP
|
|
Package Description |
HLFQFP, QFP144,.87SQ,20
|
22 X 22 MM, 0.50 MM PITCH, EQFP-144
|
Pin Count |
144
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
e0
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
392
|
392
|
Number of Inputs |
91
|
91
|
Number of Logic Cells |
6272
|
6272
|
Number of Outputs |
91
|
91
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
392 CLBS
|
392 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLFQFP
|
HLFQFP
|
Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
20 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
|
|
|
Compare EP4CE6E22C7 with alternatives
Compare EP4CE6E22C6 with alternatives