EP4CE6E22I7
vs
EP4CE6E22I7N
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
22 X 22 MM, 0.50 MM PITCH, EQFP-144
|
22 X 22 MM, 0.50 MM PITCH, LEAD FREE, EQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e0
|
e2
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
392
|
392
|
| Number of Inputs |
91
|
91
|
| Number of Logic Cells |
6272
|
6272
|
| Number of Outputs |
91
|
91
|
| Number of Terminals |
144
|
144
|
| Organization |
392 CLBS
|
392 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLFQFP
|
HLFQFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
1.65 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
Matte Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EP4CE6E22I7 with alternatives
Compare EP4CE6E22I7N with alternatives