EP4CGX15BF14I7N
vs
EP4CGX15BF14C8N
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
14 X 14 MM, 1 MM PITCH, LEAD FREE, FBGA-169
|
14 X 14 MM, 1 MM PITCH, LEAD FREE, FBGA-169
|
| Pin Count |
169
|
169
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
S-PBGA-B169
|
S-PBGA-B169
|
| JESD-609 Code |
e1
|
e1
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
900
|
900
|
| Number of Inputs |
72
|
72
|
| Number of Logic Cells |
14400
|
14400
|
| Number of Outputs |
72
|
72
|
| Number of Terminals |
169
|
169
|
| Organization |
900 CLBS
|
900 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA169,13X13,40
|
BGA169,13X13,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.24 V
|
1.24 V
|
| Supply Voltage-Min |
1.16 V
|
1.16 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
OTHER
|
|
|
|
Compare EP4CGX15BF14I7N with alternatives
Compare EP4CGX15BF14C8N with alternatives