EP4SGX110DF29I4N vs EP4SGX110DF29C3N feature comparison

EP4SGX110DF29I4N Intel Corporation

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EP4SGX110DF29C3N Altera Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, LEAD FREE, FBGA-780 29 X 29 MM, LEAD FREE, FBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e1
Length 29 mm 29 mm
Number of CLBs 4224 4224
Number of Inputs 372 372
Number of Logic Cells 105600 105600
Number of Outputs 372 372
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4224 CLBS 4224 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.3 mm 3.3 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 780
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Technology CMOS
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

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