EPCS4SI8N
vs
XC1704LPC44I
feature comparison
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Life Cycle Code |
|
Active
|
Ihs Manufacturer |
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
|
QFN
|
Package Description |
|
PLASTIC, CC-44
|
Pin Count |
|
44
|
Reach Compliance Code |
|
unknown
|
Additional Feature |
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
JESD-30 Code |
|
S-PQCC-J44
|
JESD-609 Code |
|
e0
|
Length |
|
16.5862 mm
|
Memory Density |
|
4194304 bit
|
Memory IC Type |
|
CONFIGURATION MEMORY
|
Memory Width |
|
1
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Terminals |
|
44
|
Number of Words |
|
4194304 words
|
Number of Words Code |
|
4000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
4MX1
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QCCJ
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER
|
Parallel/Serial |
|
SERIAL
|
Peak Reflow Temperature (Cel) |
|
225
|
Qualification Status |
|
COMMERCIAL
|
Seated Height-Max |
|
4.572 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
J BEND
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
16.5862 mm
|
Base Number Matches |
|
1
|
|
|
|