EPF10K100EFC256-1 vs EPF10K130EQC240-2 feature comparison

EPF10K100EFC256-1 Altera Corporation

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EPF10K130EQC240-2 Altera Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA QFP
Package Description 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 34.60 X 34.60 MM, 0.50 MM PITCH, PLASTIC, QFP-240
Pin Count 256 240
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B256 S-PQFP-G240
JESD-609 Code e0 e0
Length 17 mm 32 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 191 186
Number of Inputs 191 186
Number of Logic Cells 4992 6656
Number of Outputs 191 186
Number of Terminals 256 240
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 191 I/O 186 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA256,16X16,40 QFP240,1.3SQ,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.4 ns 0.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 4.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 20 20
Width 17 mm 32 mm
Base Number Matches 2 2

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