EPF10K200EFC672-2
vs
EPF10K200SFC672-1X
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
|
27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
9984 LOGIC ELEMENTS
|
|
| Clock Frequency-Max |
140 MHz
|
|
| JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
470
|
470
|
| Number of Inputs |
470
|
470
|
| Number of Logic Cells |
9984
|
9984
|
| Number of Outputs |
470
|
470
|
| Number of Terminals |
672
|
672
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
470 I/O
|
470 I/O
|
| Output Function |
MIXED
|
MIXED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA672,26X26,40
|
BGA672,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Propagation Delay |
0.6 ns
|
0.3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
2.1 mm
|
| Supply Voltage-Max |
2.7 V
|
2.625 V
|
| Supply Voltage-Min |
2.3 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare EPF10K200EFC672-2 with alternatives
Compare EPF10K200SFC672-1X with alternatives