EPF10K50BC356-4
vs
EPF10K50BC356-3N
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
BGA-356
LBGA,
Pin Count
356
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2880 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
2880 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
62.89 MHz
66.67 MHz
JESD-30 Code
S-PBGA-B356
S-PBGA-B356
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
274
274
Number of Inputs
274
Number of Logic Cells
2880
Number of Outputs
274
Number of Terminals
356
356
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 274 I/O
4 DEDICATED INPUTS, 274 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA356,26X26,50
BGA356,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
0.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
1.63 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
35 mm
35 mm
Base Number Matches
2
1
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Compare EPF10K50BC356-3N with alternatives