EPF10K50BC356-4 vs EPF10K50BC356-3N feature comparison

EPF10K50BC356-4 Altera Corporation

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EPF10K50BC356-3N Intel Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA-356 LBGA,
Pin Count 356
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2880 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 2880 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 62.89 MHz 66.67 MHz
JESD-30 Code S-PBGA-B356 S-PBGA-B356
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 274 274
Number of Inputs 274
Number of Logic Cells 2880
Number of Outputs 274
Number of Terminals 356 356
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 274 I/O 4 DEDICATED INPUTS, 274 I/O
Output Function REGISTERED REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA356,26X26,50 BGA356,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.6 ns 0.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.63 mm 1.63 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 35 mm 35 mm
Base Number Matches 2 1

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