EPM1270M256A4N
vs
EPM1270M256A3N
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA256,20X20,20
|
LEAD FREE, MICRO, FBGA-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT CAN ALSO OPERATE AT 3.3V
|
IT CAN ALSO OPERATE AT 3.3V
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
R-PBGA-B256
|
R-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| JTAG BST |
YES
|
YES
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
212
|
212
|
| Number of Macro Cells |
980
|
980
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
0 DEDICATED INPUTS, 212 I/O
|
0 DEDICATED INPUTS, 212 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,20
|
BGA256,20X20,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
8.1 ns
|
6.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Length |
|
11 mm
|
| Number of Inputs |
|
212
|
| Number of Outputs |
|
212
|
| Width |
|
11 mm
|
|
|
|
Compare EPM1270M256A4N with alternatives
Compare EPM1270M256A3N with alternatives