EPM1270M256C4N vs EPM1270M256C5N feature comparison

EPM1270M256C4N Altera Corporation

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EPM1270M256C5N Altera Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description LEAD FREE, MICRO, FBGA-256 LEAD FREE, MICRO, FBGA-256
Pin Count 256 256
Reach Compliance Code unknown unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Additional Feature IT CAN ALSO OPERATE AT 3.3V IT CAN ALSO OPERATE AT 3.3V
In-System Programmable YES YES
JESD-30 Code R-PBGA-B256 R-PBGA-B256
JESD-609 Code e1 e1
JTAG BST YES YES
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 212 212
Number of Macro Cells 980 980
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,20 BGA256,20X20,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 8.1 ns 10 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1

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