EPM5032SI-20
vs
PAL16L8A-2DMB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP28,.5
|
DIP, DIP20,.3
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MACROCELLS INTERCONNECTED BY PIA; 1 LAB; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
|
|
Architecture |
PAL-TYPE
|
PAL-TYPE
|
Clock Frequency-Max |
62.5 MHz
|
|
JESD-30 Code |
R-PDSO-G28
|
R-XDIP-T20
|
JESD-609 Code |
e0
|
e0
|
Length |
17.9 mm
|
|
Number of Dedicated Inputs |
7
|
|
Number of I/O Lines |
16
|
|
Number of Inputs |
24
|
16
|
Number of Outputs |
16
|
8
|
Number of Product Terms |
320
|
64
|
Number of Terminals |
28
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
7 DEDICATED INPUTS, 16 I/O
|
|
Output Function |
MACROCELL
|
COMBINATORIAL
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP28,.5
|
DIP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
220
|
|
Programmable Logic Type |
OT PLD
|
EE PLD
|
Propagation Delay |
20 ns
|
40 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.5 mm
|
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare EPM5032SI-20 with alternatives
Compare PAL16L8A-2DMB with alternatives