EPM570F256I5N
vs
EPM570F256I5
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
INTEL CORP
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Intel
|
| Additional Feature |
|
IT CAN ALSO OPERATE AT 3.3V
|
| In-System Programmable |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B256
|
| JESD-609 Code |
|
e1
|
| JTAG BST |
|
YES
|
| Length |
|
17 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
|
160
|
| Number of Inputs |
|
160
|
| Number of Macro Cells |
|
440
|
| Number of Outputs |
|
160
|
| Number of Terminals |
|
256
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
0 DEDICATED INPUTS, 160 I/O
|
| Output Function |
|
MACROCELL
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Programmable Logic Type |
|
FLASH PLD
|
| Propagation Delay |
|
8.7 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.2 mm
|
| Supply Voltage-Max |
|
2.625 V
|
| Supply Voltage-Min |
|
2.375 V
|
| Supply Voltage-Nom |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
17 mm
|
| Base Number Matches |
|
1
|
|
|
|
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