EPM570F256I5N
vs
EPM570F256C5
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Additional Feature |
IT CAN ALSO OPERATE AT 3.3V
|
IT CAN ALSO OPERATE AT 3.3V
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
160
|
160
|
| Number of Inputs |
160
|
160
|
| Number of Macro Cells |
440
|
440
|
| Number of Outputs |
160
|
160
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
0 DEDICATED INPUTS, 160 I/O
|
0 DEDICATED INPUTS, 160 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
8.7 ns
|
8.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
17 X 17 MM, 1 MM PITCH, FBGA-256
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
|
|
|
Compare EPM570F256I5N with alternatives
Compare EPM570F256C5 with alternatives