EPM7096LC68-10
vs
EPM7064LC68-10
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ALTERA CORP
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
QCCJ,
|
PLASTIC, LCC-68
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Additional Feature |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
|
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
|
| Clock Frequency-Max |
125 MHz
|
125 MHz
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.2316 mm
|
24.2316 mm
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
52
|
52
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
0 DEDICATED INPUTS, 52 I/O
|
0 DEDICATED INPUTS, 52 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
220
|
220
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
10 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
24.2316 mm
|
24.2316 mm
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
| In-System Programmable |
|
NO
|
| JTAG BST |
|
NO
|
| Number of Macro Cells |
|
64
|
| Package Equivalence Code |
|
LDCC68,1.0SQ
|
|
|
|
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