EPM7128AFI100-10
vs
EPM7128AEFC100-12
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA100,10X10,40
|
TBGA, BGA100,10X10,40
|
Pin Count |
100
|
100
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
87 MHz
|
100 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
JESD-609 Code |
e0
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
11 mm
|
11 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
84
|
84
|
Number of Macro Cells |
128
|
128
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
0 DEDICATED INPUTS, 84 I/O
|
0 DEDICATED INPUTS, 84 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
TBGA
|
Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
220
|
220
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
10 ns
|
12 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EPM7128AFI100-10 with alternatives
Compare EPM7128AEFC100-12 with alternatives