EPM7256AEQI208-7N
vs
EPM7256AFI256-5
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
QFP
|
BGA
|
Package Description |
PLASTIC, QFP-208
|
TBGA,
|
Pin Count |
208
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
YES
|
|
Clock Frequency-Max |
126.6 MHz
|
|
In-System Programmable |
YES
|
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
JESD-609 Code |
e3
|
e1
|
JTAG BST |
YES
|
|
Length |
28 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
164
|
164
|
Number of Macro Cells |
256
|
|
Number of Terminals |
208
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
0 DEDICATED INPUTS, 164 I/O
|
0 DEDICATED INPUTS, 164 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
TBGA
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
7.5 ns
|
5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
1.1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
28 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EPM7256AEQI208-7N with alternatives
Compare EPM7256AFI256-5 with alternatives