EPM7256SRI208-10N
vs
EPM7256AFI256-5
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
RQFP-208
|
TBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
|
|
| Clock Frequency-Max |
125 MHz
|
|
| In-System Programmable |
YES
|
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
e1
|
| JTAG BST |
YES
|
|
| Length |
28 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
164
|
164
|
| Number of Macro Cells |
256
|
|
| Number of Terminals |
208
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
0 DEDICATED INPUTS, 164 I/O
|
0 DEDICATED INPUTS, 164 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
TBGA
|
| Package Equivalence Code |
HQFP208,1.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, THIN PROFILE
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
1.1 mm
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
4.5 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
17 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
256
|
|
|
|
Compare EPM7256SRI208-10N with alternatives
Compare EPM7256AFI256-5 with alternatives