EXB30-48D05-3V3J
vs
AV60C-048L-033F06
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
VERTIV CO
|
ASTEC AMERICA INC
|
| Package Description |
ROHS COMPLIANT PACKAGE-9
|
DIP, DIP10,1.9,400/300
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
ADDITIONAL 3.3V OUTPUT ALSO AVAILABLE
|
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
75 V
|
75 V
|
| Input Voltage-Min |
36 V
|
36 V
|
| Input Voltage-Nom |
48 V
|
48 V
|
| JESD-30 Code |
R-XDMA-P9
|
R-XDMA-P9
|
| Load Regulation-Max |
0.4%
|
0.5%
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
2
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
70 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
5.55 V
|
3.63 V
|
| Output Voltage-Min |
4.45 V
|
2.64 V
|
| Output Voltage-Nom |
5 V
|
3.3 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DMA
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Total Power Output-Max |
30 W
|
21.5 W
|
| Trim/Adjustable Output |
YES
|
YES
|
| Base Number Matches |
2
|
3
|
| JESD-609 Code |
|
e0
|
| Output Current-Max |
|
6.5 A
|
| Package Equivalence Code |
|
DIP10,1.9,400/300
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
7.62 mm
|
|
|
|
Compare EXB30-48D05-3V3J with alternatives
Compare AV60C-048L-033F06 with alternatives