EZR32LG230FE55G
vs
CC1310F64RSMT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XQCC-N64
|
S-PQCC-N32
|
| Length |
9 mm
|
4 mm
|
| Number of Terminals |
64
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Supply Voltage-Max |
3.8 V
|
3.8 V
|
| Supply Voltage-Min |
1.98 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
5A992.C
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| CPU Family |
|
CORTEX-M3
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (bytes) |
|
28672
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare EZR32LG230FE55G with alternatives
Compare CC1310F64RSMT with alternatives