FAN2002MPX
vs
FAN2002MPX
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Active
|
Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS INC
|
Package Description |
MLP-6
|
HVQCCN,
|
Manufacturer Package Code |
511CP
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
onsemi
|
|
Additional Feature |
ALSO OPERATES IN PFM MODE
|
ALSO OPERATES IN PFM MODE
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
2.5 V
|
2.5 V
|
JESD-30 Code |
S-XQCC-N6
|
S-XQCC-N6
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
2 A
|
2 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
SOLCC6,.11,37
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
1500 kHz
|
1500 kHz
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SON
|
Pin Count |
|
6
|
|
|
|