FDZ208P
vs
FDZ208P
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
ULTRA THIN, BGA-30
|
ULTRA THIN, BGA-30
|
| Pin Count |
30
|
30
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
30 V
|
30 V
|
| Drain Current-Max (ID) |
12.5 A
|
12.5 A
|
| Drain-source On Resistance-Max |
0.0105 Ω
|
0.0105 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PBGA-B30
|
R-PBGA-B30
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
30
|
30
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Power Dissipation-Max (Abs) |
2.2 W
|
|
| Pulsed Drain Current-Max (IDM) |
60 A
|
60 A
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
NOT SPECIFIED
|
|
|
|
Compare FDZ208P with alternatives
Compare FDZ208P with alternatives