FDZ208P
vs
FDMC7672
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
MLP
|
| Package Description |
ULTRA THIN, BGA-30
|
3.30 X 3.30 MM, ROHS COMPLIANT, MLP, 8 PIN
|
| Pin Count |
30
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
30 V
|
30 V
|
| Drain Current-Max (ID) |
12.5 A
|
16.9 A
|
| Drain-source On Resistance-Max |
0.0105 Ω
|
0.0057 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PBGA-B30
|
S-PDSO-N5
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
30
|
5
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Polarity/Channel Type |
P-CHANNEL
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
60 A
|
50 A
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NOT SPECIFIED
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
6
|
| Manufacturer Package Code |
|
8LD,MLP,DUAL, 3.3MM SQUARE
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.29.00.95
|
| Additional Feature |
|
ULTRA-LOW RESISTANCE
|
| Avalanche Energy Rating (Eas) |
|
144 mJ
|
| Case Connection |
|
DRAIN
|
| JESD-609 Code |
|
e4
|
| Operating Temperature-Max |
|
150 °C
|
| Power Dissipation-Max (Abs) |
|
2.3 W
|
|
|
|
Compare FDZ208P with alternatives
Compare FDMC7672 with alternatives