FM1608B-SG
vs
FM18L08-70-S
feature comparison
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
RAMTRON INTERNATIONAL CORP
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SOP, SOP28,.4
|
| Pin Count |
|
28
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Access Time-Max |
|
70 ns
|
| Additional Feature |
|
UNLIMITED READ/WRITE CYCLES
|
| Data Retention Time-Min |
|
45
|
| JESD-30 Code |
|
R-PDSO-G28
|
| JESD-609 Code |
|
e0
|
| Length |
|
17.9 mm
|
| Memory Density |
|
262144 bit
|
| Memory IC Type |
|
FRAM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
28
|
| Number of Words |
|
32768 words
|
| Number of Words Code |
|
32000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
32KX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP28,.4
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.65 mm
|
| Standby Current-Max |
|
0.000015 A
|
| Standby Voltage-Min |
|
3 V
|
| Supply Current-Max |
|
0.015 mA
|
| Supply Voltage-Max (Vsup) |
|
3.65 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.5 mm
|
| Base Number Matches |
|
2
|
|
|
|
Compare FM18L08-70-S with alternatives