FQB19N20C vs FDB2670 feature comparison

FQB19N20C Fairchild Semiconductor Corporation

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FDB2670 Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description SMALL OUTLINE, R-PSSO-G2 D2PAK-3
Pin Count 3 3
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.29.00.95
Avalanche Energy Rating (Eas) 433 mJ 375 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 200 V 200 V
Drain Current-Max (ID) 19 A 19 A
Drain-source On Resistance-Max 0.17 Ω 0.13 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PSSO-G2 R-PSSO-G2
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 76 A 40 A
Qualification Status Not Qualified COMMERCIAL
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code D2PAK
JEDEC-95 Code TO-263AB
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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