FT232RL
vs
UPD1002T-A/MQ
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SSOP-28
|
SQFN-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
Microchip
|
| Address Bus Width |
|
|
| Bus Compatibility |
UART
|
SMBUS; SPI; VBUS
|
| Drive Interface Standard |
RS232; RS422; RS485
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G28
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10.2 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
28
|
32
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SSOP
|
HVQCCN
|
| Package Equivalence Code |
SSOP28,.307
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2 mm
|
1 mm
|
| Supply Voltage-Max |
5.25 V
|
5.3 V
|
| Supply Voltage-Min |
3.3 V
|
3.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.3 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
5
|
1
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare FT232RL with alternatives
Compare UPD1002T-A/MQ with alternatives