FT3150-P20
vs
HD1-15531B-2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ECHELON CORP
|
RENESAS ELECTRONICS CORP
|
| Package Description |
TQFP-64
|
DIP, DIP40,.6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G64
|
R-XDIP-T40
|
| Length |
14 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
64
|
40
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
LQFP
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.8 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
14 mm
|
|
| Base Number Matches |
4
|
3
|
| Package Equivalence Code |
|
DIP40,.6
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
|
|
|
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