FT3150-P20
vs
HD9P6409-9Z
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ECHELON CORP
|
INTERSIL CORP
|
| Package Description |
TQFP-64
|
SOP, SOP20,.4
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G64
|
R-PDSO-G20
|
| Length |
14 mm
|
12.8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Seated Height-Max |
1.6 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
14 mm
|
7.5 mm
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
26 Weeks
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
SOP20,.4
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare FT3150-P20 with alternatives
Compare HD9P6409-9Z with alternatives