FT61256L-70CWMBLF
vs
P4C1256L-70CWCLF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.600 Inch, Rohs Compliant, Ceramic, Dip-28
|
0.600 Inch, Rohs Compliant, Ceramic, Side Brazed, Dip-28
|
| Pin Count |
28
|
28
|
| ECCN Code |
3A001.a.2.c
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 Ns
|
70 Ns
|
| Additional Feature |
Lg-Max
|
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| Length |
37.719 Mm
|
37.846 Mm
|
| Memory Density |
262144 Bit
|
262144 Bit
|
| Memory IC Type |
Standard Sram
|
Standard Sram
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 Words
|
32768 Words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
Asynchronous
|
Asynchronous
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
32kx8
|
32kx8
|
| Package Body Material |
Ceramic, Metal-Sealed Cofired
|
Ceramic, Metal-Sealed Cofired
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
In-Line
|
In-Line
|
| Parallel/Serial |
Parallel
|
Parallel
|
| Peak Reflow Temperature (Cel) |
Not Specified
|
Not Specified
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
Mil-Std-883
|
|
| Seated Height-Max |
5.8928 Mm
|
5.8928 Mm
|
| Supply Current-Max |
0.1 Ma
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
No
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Military
|
Commercial
|
| Terminal Form |
Through-Hole
|
Through-Hole
|
| Terminal Pitch |
2.54 Mm
|
2.54 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
Not Specified
|
| Width |
7.62 Mm
|
15.24 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|