FXL2T245L10X
vs
FXL2T245L10X_NL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
MICROPAK MLP
|
QFN
|
| Package Description |
1.60 X 2.10 MM, MO-255, MICRO PAK, 10
|
VBCC,
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED)
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-XBCC-B10
|
R-XBCC-B10
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2.1 mm
|
2.1 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VBCC
|
VBCC
|
| Package Equivalence Code |
LCC10,.06X.08,20
|
LCC10,.06X.08,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.55 mm
|
0.55 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.1 V
|
1.1 V
|
| Supply Voltage-Nom |
1.4 V
|
1.4 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL GOLD
|
NICKEL GOLD
|
| Terminal Form |
BUTT
|
BUTT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
2
|
1
|
|
|
|