GAL16V8B-10LJ vs GAL16V8D-10LD/883 feature comparison

GAL16V8B-10LJ Lattice Semiconductor Corporation

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GAL16V8D-10LD/883 Lattice Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code QLCC DIP
Package Description PLASTIC, LCC-20 CERAMIC, DIP-20
Pin Count 20 20
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature REGISTER PRELOAD; POWER-UP RESET
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 58.8 MHz 58.8 MHz
JESD-30 Code S-PQCC-J20 R-GDIP-T20
JESD-609 Code e0 e0
Length 8.9662 mm 25.27 mm
Moisture Sensitivity Level 1 1
Number of Dedicated Inputs 8 8
Number of I/O Lines 8 8
Number of Inputs 18 18
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code QCCJ DIP
Package Equivalence Code LDCC20,.4SQ DIP20,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm 7.62 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Samacsys Manufacturer Lattice Semiconductor
Screening Level MIL-STD-883

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